This camera is suitable for the spectral range of 400-1700nm, covering the visible light to shortwave infrared region. It is equipped with a Si+InGaAs dual sensor array and integrates multiple image preprocessing technologies. By using a Gigabit Ethernet interface, high-speed and lossless data transmission is achieved, ensuring real-time image transmission without frame loss and meeting high-precision requirements. At the same time, it supports user customized algorithms and direct integration into the camera, providing highly flexible and accurate image acquisition and analysis solutions.
-Adopting Si+InGaAs sensors supporting 0.4 μM~1.7 um-wide spectral imaging
-Excellent heat dissipation design and excellent power consumption design
-New exterior structural design supporting five sided installation
-Implant rich ISP functions such as noise reduction and correction
-Gigabit network interface with a maximum transmission distance of up to 100m (no relay)
-Rich interfaces such as Rs485 encoder signal input, isolated input/output lO, etc
-85KFPGA logic resources, dual core A9 ARM processor, 1GB memory powerful computing and processing capabilities
-Built in embedded Linux operating system convenient for software development and management
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| MODEL | GD9L0-130CN-G2 | GD9L0-33CN-G2 |
| parameter | 1.3 million pixel industrial short-wave infrared array camera | 33 million pixel industrial short-wave infrared array camera |
| PERFORMANCE | ||
| Type of sensor | Si+InGaAs | |
| Pixel size | 5μm×5μm | |
| Target size | 1/2″ | 1/4″ |
| Resolution | 1280×1024 | 640×512 |
| Maximum frame rate | 38FPS@1280×1024 | 152FPS@640×512 |
| Dynamic range | 56dB | |
| Signal to noise ratio | 52dB | |
| Gain | 0dB～18dB | |
| Exposure time | 7μs～0.1s | |
| Shutter mode | Global exposure, support automatic exposure, manual exposure and other modes | |
| Pixel format | Mono 8/10/12 | |
| Mirror image | Support horizontal mirror, vertical mirror output | |
| ELECTRICAL SPECIFICATION | ||
| Data interface | Gigabit Ethernet ( 1000Mbs ) Compatible Fast Ethernet ( 100Mbs ) | |
| I/ODigitalI/0 | 15PIN DB15 connector provides power andI/0:2 optocoupler isolated inputs, 3 optocoupler isolated outputs,1 isolated RS485,2 differential inputs(for coded signals) | |
| Power supply | Typical value 12VDC | |
| Power consumption | <6W | |
| STRUCTURE | ||
| Lens interface | C-Mount | |
| Installation method | 5 | |
| Appearance size | 64mm×64mm×56.5mm | |
| Weight | About 300g | |
| IP | IP40 | |
| Temperature | The working temperature is-10℃～55℃,and the storage temperature is-20℃～70℃. | |
| Humidity | 20%～95%RH | |
| GENERAL SPECIFICATION | ||
| Software protocol | Customized protocol, TCP protocol to transmit images, using customized view software | |
| SDK | Support Linux and Windows call SDK for secondary development | |
-Semiconductor testing
-Solar silicon-based detection
-Glass cover plate inspection
-Garbage classification
-Fruit Dark Dame Detection
-Fluorescence imaging
-Laser spot tracking
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