R&D Personnel
Authorized Patents
Testing and Evaluation Center
Class 10,000 Cleanroom
360 Authorized Patents
We collaborate with the University of Science and Technology of China and upstream/downstream research institutions in the research of core components, conducting extended growth techniques based on III-V compound materials in the InGaAs production line.
We also engage in research on wafer processing platforms and various flip-chip and testing platforms, possessing a complete set of capabilities including design, wafer fabrication, packaging, manufacturing, and quality control.
Our optoelectronic integration device assembly center is equipped with over 40 advanced packaging and testing machines from both domestic and international sources. We have the capability for mass production using cutting-edge processes such as sub-micron level optical quantum chip assembly, optoelectronic device die bonding, eutectic bonding, wire bonding, coupling, collimation, sealing, and testing.
We strictly adhere to the ISO quality management system and implement rigorous quality control measures throughout the production process of our optoelectronic products. From raw material procurement to final product delivery, every stage of our production is governed by stringent quality inspection standards and procedures. Our quality assurance team is equipped with advanced testing equipment and technology to ensure that each production batch meets our customers’ requirements and standards. Additionally, we continuously improve and optimize our quality management system to ensure the stability and reliability of product quality.
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